Hybrid Software 已宣布融合包装峰会 2026定于 4 月 19 日至 22 日在佛罗里达州萨拉索塔的威斯汀酒店举行。峰会将汇集来自贸易商店、转换器、品牌和行业专家的利益相关者，共同参与以包装创新为中心的前瞻性活动。议程将深入探讨跨柔印、胶印、凹印和数字印刷平台的自动化、人工智能和色彩管理，强调 Hybrid Software 的多技术方法。
"The Fusion Packaging Summit provides a platform to get together with our customers and partners in North America and plan for the future," said CEO Mike Rottenborn. Following the success of the inaugural event in Amsterdam, which drew attendees from 23 countries, Hybrid has committed to making this a recurring event alternating between continents. Registration opens in late September 2025.
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