The interpack 2026 Spotlight Forum will return as a central platform for industry dialogue, bringing together experts from industry, politics, associations, start-ups, and research institutions. Running from 7–13 May in Düsseldorf, the programme will include around 75 presentations, panel discussions, and sessions covering key developments shaping the packaging industry. Organized by interpack, dfv Conference Group, and PackReport, the forum follows the theme “7 Days, 7 Topics,” with each day dedicated to a specific topic such as regulatory developments, resource efficiency, smart packaging, automation, circular economy, innovative materials, and attracting young talent to the industry.
The programme will address major issues including the European Packaging and Packaging Waste Regulation (PPWR), digital product passports, automation and AI-driven production, and new sustainable material solutions. Industry experts from companies such as Syntegon, Domino, Metsä Board, Henkel, and tesa will share insights into practical implementations and future strategies, while panel discussions will explore the impact of regulations, supply chain pressures, and technological innovation. The final day of the forum will focus on workforce development, highlighting strategies for attracting and retaining young professionals through industry collaboration and new training initiatives.
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