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Hybrid Software Finalizes Plans for the Fusion Packaging Summit in Amsterdam April 22-25

(Ghent, Belgium) Hybrid Software is set to host a premier event in the label and packaging printing industry: the Hybrid Fusion Packaging Summit 2025. Taking place in Amsterdam, this three-day summit will bring together global industry leaders for an opportunity to learn, exchange ideas, and gain practical insights on driving operational efficiencies, embracing digital transformation, and meeting sustainability targets. The event will be held at the NH Collection Amsterdam Barbizon Palace from April 22-25, 2025. It promises to be a customer-first experience with a full agenda designed to empower attendees through interactive sessions, industry-acclaimed keynote speakers, and networking opportunities. The program will be available in French, German, Italian, and Spanish to accommodate an international audience. 

The summit is co-sponsored by industry leaders Arden Software, HP, ECO3, ABG, AV Flexologic, Bobst, CERM, Conics, Global Vision, Infigo, Koenig & Bauer, and XSYS, with highly relevant keynote addresses by Marco Boer and David Zwang. The summit will include factory visits to three industry-leading Hybrid Software customers and partners -- Geostick, Intergrafipak, and AV Flexologic -- who will share their state-of-the-art facilities for the production of labels, folding cartons, and mounted flexo printing plates. Fusion 2025 also incorporates a Partner Program, ensuring attendees’ partners enjoy cultural exploration, unique local experiences, and delightful culinary moments. For more information see the agenda here!

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