HiFlow solutions a silver sponsor of digital packaging summit

 [Miami, November 25, 2020] - HiFlow Solutions announces that on December 1-3, 2020 it will be participating in the Digital Packaging Summit as a Silver Sponsor. The Digital Packaging Summit is an invitation-only, hosted event specifically designed for senior-level managers and business executives in label and package printing and converting who are looking to develop strategies, understand their options and make major investment decisions around digital printing, finishing, and software technology. 

 The goal of the Digital Packaging Summit is to provide attendees with a focused conference program that covers the key topics needed to understand their options, challenges, economics and critical decision-making criteria, while providing valuable peer-to-peer interaction and experiences. HiFlow Solutions will be presenting end-user case studies and having one-to-one interactions with senior level executives at packaging companies to help packaging companies make more informed decisions on packaging automation software. 

HiFlow Solutions is excited to be a participant in the virtual event. HiFlow’s comprehensive MIS/MES system is designed for packaging and label printers, offering streamlined, end-to-end management of processes, materials, machines and people. With its innovative Workflow Diagram, the powerful MIS offers ease of use and instant understanding of the complete production workflow. All of our other extensive features specifically support the needs of packaging and label industry, and our international customer base includes over 100 packaging, label, flexo and folding box manufacturers. 

Jack Lafler, Vice President of Technology, explains: “New packaging technologies are exploding onto the scene. This event is for customers interested in exploring technologies that will propel them into Industry 4.0. The HiFlow system is one such technology. We look forward to having some synergistic conversations with business executives who understand the benefits of implementing automation in their plants.” 

The event’s sessions and conference program take place December 1-3 with additional opportunities for 1:1 meetings December 4 – 11. 

To register, visit: www.digitalpackagingsummit.com/attend/     

To reach us to make an appointment, contact Jack Lafler, 786-757-9248. 

HiFlow Solutions provides flexible MIS / MES systems that help label and packaging manufacturers as well as printing houses to operate more efficiently and profitably.   The company delivers a complete range of services including: a leading-edge MIS system; integration with machines services to ensure seamless operations; and consultative services for utilizing technology to drive efficiency, build scale, and improve profitability. HiFlow offers custom software development services for packaging, label and printing companies. HiFlow Solutions has been providing MIS and MES solutions for more than 20 years for over 100 clients. Its international sales headquarters is in Miami, Florida.    

To learn more about HiFlow Solutions, please visit www.hiflowsolutions.com

 LinkedIn - https://www.linkedin.com/company/hiflow-solutions/about/