TOPPAN Digital Inc., a wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has confirmed its participation in the upcoming AIPIA & AWA Smart Packaging World Congress 2025, taking place June 23–24 at the Steigenberger Airport Hotel in Amsterdam. A regular exhibitor at the event, TOPPAN will unveil its latest advancements in smart packaging powered by RFID and NFC technologies, with a particular focus on high-value sectors such as fashion, fragrance, beauty, and wine & spirits.

Under the theme “Unlocking the Power of Connected Retail,” TOPPAN Digital will deliver a featured presentation on June 24, showcasing how its integrated NFC solutions can enhance brand engagement, support regulatory compliance, and streamline retail operations. Among the highlights will be new smart packaging formats with embedded NFC tags for product authentication, LED-enhanced cosmetic packaging, and Digital Product Passport (DPP)-ready solutions for apparel and accessories.

The company’s suite of innovations includes tools for inventory management, expiration tracking, product recall, and customer interaction, supporting brands’ efforts to reduce waste, comply with EU regulations, and deliver next-generation consumer experiences. TOPPAN’s offerings will also feature its cloud-based product ID authentication platform, now bolstered by its collaboration with Belgian IoT specialist Selinko.

The AIPIA & AWA Smart Packaging World Congress brings together global leaders in smart packaging to discuss emerging trends, technologies, and strategies that are reshaping how products are packaged, tracked, and experienced by consumers. For more information on the event, visit AIPIAWC25.